Electronic Design Automation EDA Software : High Speed Field Solutions : High Frequency Signal & Power Integrity : Package & Board Modeling and Design : Physware, Inc. Electronic Design Automation EDA Software : High Speed Field Solutions : High Frequency Signal & Power Integrity : Package & Board Modeling and Design : Physware, Inc.
Electronic Design Automation EDA Software : High Speed Field Solutions : High Frequency Signal & Power Integrity : Package & Board Modeling and Design : Physware, Inc.
Recent Coverage

11 June 08
True 3D EM SI-PI-EMI Solutions  


20 May 08
Physware Partners with Spatial  


11 May 08
Physware, a Founding Partner in Synopsys HSpice Integrator Program  
Events & Conferences
Aug 18-22, 2008
EMC 2008
Detroit, Michigan
 
Career Opportunities
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US West (Bay Area)
Japan
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PhysPack - think beyond the die 

Design for Integrity™ 3D Broadband Full-Wave Solutions for SI-PI-EMI in Systems-in-Package


Features

3D Electromagnetic Simulation

  • Accelerated boundary element technology
  • O(N) memory and time scalability
  • Full-wave and Quasi-static mode choices
  • Rigorous broadband material and loss models
  • Frequency dependent losses and inductance, skin effects and radiation effects
  • Current and voltage source, port and multiple plane wave excitations
  • Scalable load-balanced multi-core compressed boundary element matrix solver
  • Fast frequency sweep
  • OpenMP and MPI based integrated hybrid computing platform support
  • Macromodel component libraries
  • Windows and Linux, 32-bit and 64-bit

    Enhanced Usability and GUI Features

  • Package layout editing and healing
  • Selection by net, region, and cross annotation
  • Cropping by layer for 3d tunneling
  • Accelerated automated port setup
  • Package and board merging
  • PoP and SiP support
  • Integration of macromodels and SPICE elements
  • Multiple simulation queues
  • Choice of number of simulation threads
  • Automated intelligent meshing
  • Full 3D control on bond wire, solder ball, and solder bump design
  • Topology-geometry connectivity for SPICE-EM co-simulation

    Visualization and Data Transfer

  • Near field and far field plots
  • Contour lines and maps
  • Radar cross section and radiation patterns
  • Current density plots
  • Coupling coefficient plots
  • S,Y, and Z output, input, and visualization
  • Single-ended, differential, and common mode S-parameters
  • Passivity and causality preserved S and RLC
  • S-parameter to RLC conversion
  • Direct RLC generation for package models
  • Touchstone S-parameter output
  • SPICE netlist and IBIS model generation
  • TDR and TDT waveform generation

    Integration with Layout Tools

  • Import directly from Cadence Allegro: .mcm, .brd, .sip
  • GDS and CIF import

    Integration with Circuit Simulators

  • Export S-parameter and RLC models directly to HSPICE, Spectre, SigXP
  • Import Touchstone, HSPICE and Spectre models for co-simulation



    Extended Options

  • Customized import support (DXF, Mentor, Zuken)
  • LSF support for task distribution on clusters
  • Quasi-static full-package model generation
  • Full-featured EMI input and output
  • Extended multi-core engine

  •  
    Visit us at EMC 2008!