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PhysPack - think beyond the die 
Design for Integrity™ 3D Broadband Full-Wave Solutions for SI-PI-EMI in Systems-in-Package
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Applications
Complex BGA and bond-wire packages
Package-on-package configurations
Systems-in-package and MCMs
Multilayered boards
Coplanar packages
QFN, QFP, leadframe packages
SERDES Applications
DDR memory interfaces
Embedded passives
Inductor design
Detailed via, transition, interconnect, bond-wire, solder ball
Solder bump modeling
Package and board merged configurations
Planar phased arrays
Radiation, impedance, and crosstalk
RFID tag modeling
EMI prediction from board-package configurations
Stacked die
Redistribution Layer (RDL) modeling
Complete power integrity, signal integrity, and EMI analysis
Power distribution networks
Signal-power coupling
Substrate effects
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